ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,092, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Apparatus for processing substrate and method of transferring substra... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,093, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Method for creating product-like stressed surrogate test wafers" was ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,094, issued on July 14, was assigned to INGENTEC Corp. (Miaoli County, Taiwan). "Micro-LED wafer testing device and micro-LED wafer testing... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,095, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "In-situ integrated wafer parameter detection system ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,096, issued on July 14, was assigned to Korea Advanced Institute of Science and Technology (Daejeon, South Korea). "Method of manufacturing... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,098, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Multi-function etching sacrific... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,099, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Method of multi-layer die stacking with die-to-wafer... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,100, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Redistribution layer metallic s... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,101, issued on July 14, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan). "Semiconductor device with a liner layer" was invented... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,102, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Advanced pitch interconnects with multiple l... Read More